Materials for Advanced Packaging

  • Filename: materials-for-advanced-packaging.
  • ISBN: 9780387782195
  • Release Date: 2008-12-17
  • Number of pages: 724
  • Author: Daniel Lu
  • Publisher: Springer Science & Business Media

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Advanced Materials for Thermal Management of Electronic Packaging

  • Filename: advanced-materials-for-thermal-management-of-electronic-packaging.
  • ISBN: 1441977597
  • Release Date: 2011-01-05
  • Number of pages: 618
  • Author: Xingcun Colin Tong Ph.D
  • Publisher: Springer Science & Business Media

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Advanced electronic packaging

  • Filename: advanced-electronic-packaging.
  • ISBN: STANFORD:36105114517258
  • Release Date: 2006-02-10
  • Number of pages: 812
  • Author: Richard K. Ulrich
  • Publisher: Wiley-IEEE Press

This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.

Innovations in Food Packaging

  • Filename: innovations-in-food-packaging.
  • ISBN: 9780123948359
  • Release Date: 2013-10-03
  • Number of pages: 624
  • Author: Jung H. Han
  • Publisher: Academic Press

This new edition of Innovations in Food Packaging ensures that readers have the most current information on food packaging options, including active packaging, intelligent packaging, edible/biodegradable packaging, nanocomposites and other options for package design. Today's packaging not only contains and protects food, but where possible and appropriate, it can assist in inventory control, consumer education, increased market availability and shelf life, and even in ensuring the safety of the food product. As nanotechnology and other technologies have developed, new and important options for maximizing the role of packaging have emerged. This book specifically examines the whole range of modern packaging options. It covers edible packaging based on carbohydrates, proteins, and lipids, antioxidative and antimicrobial packaging, and chemistry issues of food and food packaging, such as plasticization and polymer morphology. Professionals involved in food safety and shelf life, as well as researchers and students of food science, will find great value in this complete and updated overview. New to this edition: Over 60% updated content — including nine completely new chapters — with the latest developments in technology, processes and materials Now includes bioplastics, biopolymers, nanoparticles, and eco-design of packaging


  • Filename: nanopackaging.
  • ISBN: 9780387473260
  • Release Date: 2008-12-30
  • Number of pages: 543
  • Author: James E. Morris
  • Publisher: Springer Science & Business Media

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Phase Change Materials

  • Filename: phase-change-materials.
  • ISBN: 9780387848747
  • Release Date: 2010-06-10
  • Number of pages: 430
  • Author: Simone Raoux
  • Publisher: Springer Science & Business Media

"Phase Change Materials: Science and Applications" provides a unique introduction of this rapidly developing field. Clearly written and well-structured, this volume describes the material science of these fascinating materials from a theoretical and experimental perspective. Readers will find an in-depth description of their existing and potential applications in optical and solid state storage devices as well as reconfigurable logic applications. Researchers, graduate students and scientists with an interest in this field will find "Phase Change Materials" to be a valuable reference.

Materials for Information Technology

  • Filename: materials-for-information-technology.
  • ISBN: 9781846282355
  • Release Date: 2006-07-02
  • Number of pages: 508
  • Author: Ehrenfried Zschech
  • Publisher: Springer Science & Business Media

This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

Polymers for Packaging Applications

  • Filename: polymers-for-packaging-applications.
  • ISBN: 9781926895772
  • Release Date: 2014-09-12
  • Number of pages: 486
  • Author: Sajid Alavi
  • Publisher: CRC Press

This book focuses on food, non-food, and industrial packaging applications of polymers, blends, nanostructured materials, macro, micro and nanocomposites, and renewable and biodegradable materials. It details physical, thermal, and barrier properties as well as sustainability, recycling, and regulatory issues. The book emphasizes interdisciplinary research on processing, morphology, structure, and properties as well as applications in packaging of food and industrial products. It is useful for chemists, physicists, materials scientists, food technologists, and engineers.

Materials for Electronic Packaging

  • Filename: materials-for-electronic-packaging.
  • ISBN: 0080511171
  • Release Date: 1995-03-31
  • Number of pages: 368
  • Author: Deborah D.L. Chung
  • Publisher: Butterworth-Heinemann

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors. Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science. Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.

The Wiley Encyclopedia of Packaging Technology

  • Filename: the-wiley-encyclopedia-of-packaging-technology.
  • ISBN: 9780470541388
  • Release Date: 2010-01-05
  • Number of pages: 1368
  • Author: Kit L. Yam
  • Publisher: John Wiley & Sons

The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference

Advanced Millimeter wave Technologies

  • Filename: advanced-millimeter-wave-technologies.
  • ISBN: 047074295X
  • Release Date: 2009-03-03
  • Number of pages: 850
  • Author: Duixian Liu
  • Publisher: John Wiley & Sons

This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging

Advanced Thermoforming

  • Filename: advanced-thermoforming.
  • ISBN: 9781118207062
  • Release Date: 2012-05-09
  • Number of pages: 320
  • Author: Sven Engelmann
  • Publisher: John Wiley & Sons

Introduces the latest innovations in thermoforming materials, processes, and applications Advanced Thermoforming brings readers fully up to date with the latest standards, processes, materials, and applications in the field. From forming to filling to sealing processes, the author explains everything that can now be accomplished using the most advanced thermoforming technologies available. Moreover, readers learn how to fully leverage these technologies in order to design and manufacture products that meet all specifications at minimum cost and maximum efficiency. Emphasizing the application of advanced thermoforming for the production of technical parts and packaging, the book: Guides readers through all facets of development, design, and machine and mold technology Recommends new technologies that offer higher productivity, better quality, and lower costs Describes common raw materials used in thermoforming, including how specific materials affect the production process Explains the proper handling of semi-finished products and formed parts Sets forth the basic principles of extrusion, an essential process underlying thermoforming Introduces the latest software techniques to simulate the thermoforming of new products Throughout the book, readers learn about the latest innovations in thermoforming, from thermoformed automobile body parts to fully automated packaging assembly lines. The author offers valuable content from his interviews with leading industrial thermoformers, sharing insights and tips from their years of hands-on experience with readers. With Advanced Thermoforming as their guide, polymer and plastics engineering professionals and students can now explore and exploit the full range of possibilities that thermoforming technology offers.

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