Materials for Advanced Packaging

  • Filename: materials-for-advanced-packaging.
  • ISBN: 9783319450988
  • Release Date: 2016-11-18
  • Number of pages: 969
  • Author: Daniel Lu
  • Publisher: Springer



Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Materials for Advanced Packaging

  • Filename: materials-for-advanced-packaging.
  • ISBN: 9780387782195
  • Release Date: 2008-12-17
  • Number of pages: 724
  • Author: Daniel Lu
  • Publisher: Springer Science & Business Media



Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Materials for Advanced Packaging

  • Filename: materials-for-advanced-packaging.
  • ISBN: 3319450972
  • Release Date: 2016-11-27
  • Number of pages: 969
  • Author: Daniel Lu
  • Publisher: Springer



Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Advanced Materials for Thermal Management of Electronic Packaging

  • Filename: advanced-materials-for-thermal-management-of-electronic-packaging.
  • ISBN: 1441977597
  • Release Date: 2011-01-05
  • Number of pages: 618
  • Author: Xingcun Colin Tong Ph.D
  • Publisher: Springer Science & Business Media



The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Materials for Electronic Packaging

  • Filename: materials-for-electronic-packaging.
  • ISBN: 0080511171
  • Release Date: 1995-03-31
  • Number of pages: 368
  • Author: Deborah D.L. Chung
  • Publisher: Butterworth-Heinemann



Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors. Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science. Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.

Advanced MEMS Packaging

  • Filename: advanced-mems-packaging.
  • ISBN: 9780071627924
  • Release Date: 2009-10-22
  • Number of pages: 400
  • Author: John Lau
  • Publisher: McGraw Hill Professional



A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

Innovations in Food Packaging

  • Filename: innovations-in-food-packaging.
  • ISBN: 0080455174
  • Release Date: 2005-07-20
  • Number of pages: 503
  • Author: Jung H. Han
  • Publisher: Academic Press



Innovations in Food Packaging addresses selective topics of functions of food packaging to modify the traditional notion of this process. This book is organized into five parts. Part I focuses on the fundamental theories covering physical chemistry background and quality preservation of foods. Parts II and III discuss active packaging research and development and modified atmosphere packaging of fresh produce, meats, and ready-to-eat products, respectively. Part IV talks about edible and biodegradable coatings and films, whereas Part V discusses commercialization aspects of packaging technologies. Each part is divided into chapters of subject review and detailed technical information. This text will benefit those who are interested in innovative technology of food packaging in general, and experienced field packaging specialists and graduate-level food scientists in particular. This book will be useful as a textbook not only for extension programs of food packaging development in food industry, but also for advanced graduate-level food packaging courses. Covers four major food packaging topics: * Theories in food packaging * Active packaging * Modified atmosphere packaging * Edible films and coatings

The Wiley Encyclopedia of Packaging Technology

  • Filename: the-wiley-encyclopedia-of-packaging-technology.
  • ISBN: 9780470541388
  • Release Date: 2010-01-05
  • Number of pages: 1368
  • Author: Kit L. Yam
  • Publisher: John Wiley & Sons



The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference

Electronic Packaging and Interconnection Handbook 4 E

  • Filename: electronic-packaging-and-interconnection-handbook-4-e.
  • ISBN: 0071430482
  • Release Date: 2005
  • Number of pages: 1000
  • Author: Charles Harper
  • Publisher: McGraw Hill Professional



Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Nanopackaging

  • Filename: nanopackaging.
  • ISBN: 9780387473260
  • Release Date: 2008-12-30
  • Number of pages: 543
  • Author: James E. Morris
  • Publisher: Springer Science & Business Media



This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Advanced materials for sports equipment

  • Filename: advanced-materials-for-sports-equipment.
  • ISBN: 0412401207
  • Release Date: 1993
  • Number of pages: 127
  • Author: K. E. Easterling
  • Publisher:



Practically all sports have benefited in some crucial way by the introduction of synthetic materials. Advanced Materials in Sports Equipment is a readable introduction to these new materials. The book examines the role played by advanced materials in the design, performance, appearance and safety aspects of various equipment and indicates likely future developments.

Plastic Packaging Materials for Food

  • Filename: plastic-packaging-materials-for-food.
  • ISBN: 9783527613298
  • Release Date: 2008-07-11
  • Number of pages: 606
  • Author: Otto G. Piringer
  • Publisher: John Wiley & Sons



Plastics have developed into the most important class of packaging materials. Their relative impermeability for substances from the surroundings has great influence on the shelf life and the quality of the packed goods. At the same time the interaction between the contents and the various components of the packaging plays a decisive role. This particular book is indispensable in the search for the optimal plastic packaging. It facilitates the estimation of the influence on the goods which come from the surroundings and from the packaging. The authors do not restrict themselves only to the description of the phenomena of diffusion or transport in theory, but they show what they mean for practical applications. Food represents the central theme as main area of application for plastic packaging. It can be considered to be the "model substance" and the findings are to be applied to many other products and systems. The main rules and regulations for food packaging of the European Community and the United States are presented in this book. Furthermore the authors emphasize the testing methods for proving the mass transport and the sensory check of the quality of the products.

Polymers for Packaging Applications

  • Filename: polymers-for-packaging-applications.
  • ISBN: 9781926895772
  • Release Date: 2014-09-12
  • Number of pages: 486
  • Author: Sajid Alavi
  • Publisher: CRC Press



This book focuses on food, non-food, and industrial packaging applications of polymers, blends, nanostructured materials, macro, micro and nanocomposites, and renewable and biodegradable materials. It details physical, thermal, and barrier properties as well as sustainability, recycling, and regulatory issues. The book emphasizes interdisciplinary research on processing, morphology, structure, and properties as well as applications in packaging of food and industrial products. It is useful for chemists, physicists, materials scientists, food technologists, and engineers.

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