Introduction to multichip modules

  • Filename: introduction-to-multichip-modules.
  • ISBN: UOM:39015038441898
  • Release Date: 1995-11-23
  • Number of pages: 322
  • Author: Naveed A. Sherwani
  • Publisher: Wiley-Interscience

The first comprehensive text for the hot new multichip module technolog Introduction to Multichip Modules is the first book to provide a comprehensive introduction to the technology of MCM-based electronic packaging—an innovation that has brought tremendous improvements in performance to computing systems of all kinds A basic text and a professional reference in one, this book explores areas of relevance in both electrical engineering and computer science. It comes complete with review- and research-oriented problems, an extensive bibliography, and over 100 illustrations Useful and instructive in many ways, Introduction to Multichip Modules: Discusses the benefits as well as the problems arising from the compact packaging design of MCMs Presents technical material in a systematic way, and supplements it with information on industrial developments and applications Compares previous electronic packaging with the new technology in its discussion of the evolution of MCMs Includes material relevant to diverse industrial segments, such as thermal management groups, CAD groups, electrical simulation, and interconnect analysis groups Provides extensive technical information for designers of MCMs and MCM-based systems, while acting as a quick reference for CAD engineers involved in tool design for this technology. p>Ideal for university courses, Introduction to Multichip Modules can be used in advanced topics classes or research courses in multichip modules, electronic packaging, or CAD tools for MCMs Multichip modules (MCMs) represent the latest in packaging technology for high-performance computing systems. Developed in response to advances in integrated circuit technology, especially VLSI technologies, MCMs' compact design of bare chips on multichip modules provides superior system performance and reliability, increased operating speed, and reduced system size and weight. At the same time, this design presents its own set of challenges and problems unlike anything in traditional, single-chip-module electronic packaging. These include excess heat, electronic noise, and new electronic phenomena occurring at higher operating frequencies. Introduction to Multichip Modules is the first book to provide complete coverage of the basics of this new technology for students and professionals alike. It covers all aspects of MCM, including classification, design, and CAD tools, and explains methods and materials used in the design of MCM-based systems. This book also examines the advantages and disadvantages of various types of design; demonstrates methods of improving system reliability; and discusses the advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this book is also useful to anyone who would like to know more about the evolution of this technology and where the new advances in the field may lead us

High Performance Design Automation for Multi chip Modules and Packages

  • Filename: high-performance-design-automation-for-multi-chip-modules-and-packages.
  • ISBN: 9810223072
  • Release Date: 1996
  • Number of pages: 254
  • Author: Jun-Dong Cho
  • Publisher: World Scientific

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Multichip Modules

  • Filename: multichip-modules.
  • ISBN: 9810209258
  • Release Date: 1992
  • Number of pages: 145
  • Author: Ernest S. Kuh
  • Publisher: World Scientific

Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.

Conceptual Design of Multichip Modules and Systems

  • Filename: conceptual-design-of-multichip-modules-and-systems.
  • ISBN: 9781475748413
  • Release Date: 2013-03-14
  • Number of pages: 260
  • Author: Peter A. Sandborn
  • Publisher: Springer Science & Business Media

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

Physical Design for Multichip Modules

  • Filename: physical-design-for-multichip-modules.
  • ISBN: 9781461526827
  • Release Date: 2012-12-06
  • Number of pages: 197
  • Author: Mysore Sriram
  • Publisher: Springer Science & Business Media

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Integrated Ultra High Density Multi chip Module Packaging Design

  • Filename: integrated-ultra-high-density-multi-chip-module-packaging-design.
  • ISBN: 9780549558804
  • Release Date: 2008
  • Number of pages: 118
  • Author:
  • Publisher: ProQuest

The drive towards increased packaging density relies on the stacking of die layers in multi-chip modules (MCMs). Extremely high integration density can be achieved with these modules. There are two fundamental methods for maximizing functional density in a MCM. Either the individual die or the entire packaged die layer can be thinned. In both cases, die thinning and packaging methods must be developed. A detailed process for thinning individual die to sub-35 mum is outlined. The process consists of pseudo-wafer lamination, lapping, chemical mechanical planarization (CMP), and die release. A pseudo-wafer is created by adhering die to a glass substrate. Mechanical lapping is used to remove the bulk silicon and reduce die thickness to approximately 50 mum. CMP is used to attain thicknesses of sub-35 mum and remove the silicon damage layer. This process can reliably produce die thinned to sub-35 mum with +/- 1.5 mum total thickness variation (TTV) and good surface characteristics. The die are released from the glass substrate and encapsulated in a dielectric material. Multiple die layers can be stacked to form a MCM. For packaged layer thinning, a method is developed to encapsulate thick die in a dielectric material on a cavity wafer. Frontside processing creates multiple layers of interconnects. The encapsulated die layer is thinned to approximately 75 mum and backside processing is performed. These layers are subsequently bonded and interconnected to create the MCM.

Multilayer Ceramic Substrate Technology for VLSI Package Multichip Module

  • Filename: multilayer-ceramic-substrate-technology-for-vlsi-package-multichip-module.
  • ISBN: 185166579X
  • Release Date: 1993-04-30
  • Number of pages: 242
  • Author: K. Otsuka
  • Publisher: Springer Science & Business Media

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

Capacity Requirements Planning of Multichip Modules Through Simulation

  • Filename: capacity-requirements-planning-of-multichip-modules-through-simulation.
  • ISBN: 9780549335764
  • Release Date: 2007
  • Number of pages: 123
  • Author: Kathryn Anne Dasalla
  • Publisher: ProQuest

Currently, planners continue to utilize spreadsheets to help determine the capacities of their manufacturing systems. Through the use of simulation, the planners will have a better understanding of how resources are utilized, where bottlenecks are located, and where queues develop. By increasing the frequency of the arriving parts and reducing the lot size, this will result in an increase in resource utilization, a reduction in the WIP, and an increase in throughput.

Neuron Unit Arrays and Nature Nurture Adaptation for Photonic Multichip Modules

  • Filename: neuron-unit-arrays-and-nature-nurture-adaptation-for-photonic-multichip-modules.
  • ISBN: 9780549391111
  • Release Date: 2007
  • Number of pages: 341
  • Author:
  • Publisher: ProQuest

To implement a previously proposed 3-D hybrid electronic/photonic multichip module (PMCM) (mimicking a primate retina structure) capable of low-latency, high-throughput, parallel-processing computations, several critical hardware components are designed, fabricated, and tested. All components are made of MOSIS 1.5 mum n-well BiCMOS (bipolar complimentary metal oxide silicon) fabrication process.

Microelectronics 2nd Edition

  • Filename: microelectronics-2nd-edition.
  • ISBN: 1420037595
  • Release Date: 2005-11-09
  • Number of pages: 464
  • Author: Jerry C. Whitaker
  • Publisher: CRC Press

When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.

The Electronics Handbook

  • Filename: the-electronics-handbook.
  • ISBN: 0849383455
  • Release Date: 1996-12-23
  • Number of pages: 2575
  • Author: Jerry C. Whitaker
  • Publisher: CRC Press

The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:

Chip On Board

  • Filename: chip-on-board.
  • ISBN: 0442014414
  • Release Date: 1994-06-30
  • Number of pages: 555
  • Author: John H. Lau
  • Publisher: Springer Science & Business Media

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Micro System Technologies 90

  • Filename: micro-system-technologies-90.
  • ISBN: 9783642456787
  • Release Date: 2012-12-06
  • Number of pages: 858
  • Author: Herbert Reichl
  • Publisher: Springer Science & Business Media

On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center. Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected. The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies. The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules. Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets. For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed. New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies. The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.

The Electronics Handbook Second Edition

  • Filename: the-electronics-handbook-second-edition.
  • ISBN: 9781420036664
  • Release Date: 2005-04-27
  • Number of pages: 2640
  • Author: Jerry C. Whitaker
  • Publisher: CRC Press

During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.

Multichip Module Technologies and Alternatives The Basics

  • Filename: multichip-module-technologies-and-alternatives-the-basics.
  • ISBN: 9781461531005
  • Release Date: 2013-11-27
  • Number of pages: 875
  • Author: Daryl Ann Doane
  • Publisher: Springer Science & Business Media

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

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